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EPO-TEK® H20E – Epoxy conductive Adhesive

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SKU: 12671-20E Categories: , ,

Description

Epo-Tek® H20E is a two component, 100% solid silver-filled epoxy system, silver-resin paste and liquid hardener, mixing ration is 1:1. – Epo-Tek H22E features high thermal conductivity, and is very well suited for extensive high temperature applications (300-400°C) – Epo-Tek H20E is also a conductive adhesive of choice for old or new applications – Its applications include: chip bonding and electronic bonding as well as SEM mounting – H20E contains no solvents and will not outgas – When cured, H20E isl resistant to solvents, resin and moisture – Long Pot life (2½ days) – Shelf life is one year when store at 23°C Maximum Bond Line Cure Schedule:
175°C 45 seconds
150°C 5 minutes
120°C 15 minutes
80°C 3 hours
Typical properties: (to be used as a guide only, not a specification) Physical Properties
Color: Part A: silver; Part B: silver
Consistency: Smooth, thixotropic paste
Viscosity (@ 100 RPM / 23°C): 2,200-3,200 cPs
Thixotropic Index: 3.69
Glass Transition Temp (Tg): ≥80°C (Dynamic cure 20 – 200°C / ISO 25 Min; Ramp -10 to 200°C @ 20°C/Min)
Coefficient of Thermal Expansion (CTE): Below Tg: 31 x 10-6 in/in/°C Above Tg: 158 x 10-6 in/in/°C
Shore D hardness: 75
Lap Shear Strength @ 23°C: 1,475 psi
Die Shear Strength @ 23°C: >5 kg / 1,700 psi
Degradation Temp (TGA): 425°C
Weight Loss: @ 200°C: 0.59% @ 300°C: 1.67% @ 250°C: 1.09%
Operating Temp: Continuous: -55°C to 200°C Intermittent: -55°C to 300°C
Storage Modulus @ 23°C: 808, 700 psi
Ion: Cl- 73 ppm Na+ 2 ppm NH4+ 98 ppm K+ 3 ppm
Particle Size: ≤45 microns
Electrical Properties:
Volume Resistivity @ 23°C: ≤0.0004 Ohm-cm
  Thermal Properties:
Thermal Conductivity: 2.50 W/mK
  29 W/mK, Based on Thermal Resistance Data: R = L x K-1 x A-1
 
Thermal Resistance: (Junction to Case): TO-18 package with nickel-gold metalized 20 x 20 mil chips and bonded with Epo-Tek H20E (2 mil thick) Epo-Tek®H20E: 6.7 to 7.0°C/W Solder: 4.0 to 5.0°C/W
Storage : RT Technical Data Sheet MSDS_12671-A MSDS_12671-B