Model 300-2D, Unmounted

Description

SPM Calibration Specimens

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Overall Benefits:

_x000D_ – Easier testing of your SPM._x000D_ – Improved accuracy of critical dimension measurements._x000D_ – Accuracy: 0.5% (1 std. dev.)._x000D_

Features and Benefits:

_x000D_ – Holographic fabrication – assures high accuracy and precision._x000D_ – Pattern height > 100nm – provide excellent image contrast._x000D_ – Uniform coverage of entire chip – save time (can image anywhere)._x000D_

Description:

_x000D_ – Nominal calibrated dimensions: 300 or 700 nm._x000D_ – Calibration certificate: supplied with each sample, stating the dimension to the nearest 1 nm._x000D_ – Pattern types: 1- or 2—Dimensional. The calibrated dimension is the same for both axes for the 2-D standard._x000D_ – Feature geometry:_x000D_ – parallel ridges (1-D, 300 or 700nm)_x000D_ – cylindrical posts (2-D 300nm)
                – diamond-shaped posts (2-D 700nm)_x000D_ – Physical Size: 3 mm x 4 mm x 0.5mm._x000D_ – Substrate: Silicon wafer._x000D_ – Top surface: Tungsten film._x000D_ _x000D_  _x000D_ _x000D_ The 1-D standards can be scanned using any AFM mode, including contact mode. The 2-D standards can be scanned using modes such as Tapping Mode™, intermittent contact, and non-contact._x000D_

Model 150-1D

_x000D_ Accurate measurements of sub 0.5 micron features are increasingly important as nanotechnology develops and as conventional microfabricated structures (semiconductors, magnetic data storage devices, optical data discs) shrinking. The model 150-1D with a nominal period (pitch) of 150nm, one dimensional, fabricated on a transparent substrate (Aluminum lines on glass) is the new tool to support this work._x000D_

Model 750-HD

_x000D_ High Durability Calibration Reference Specimen for AFM and STM_x000D_ Each specimen is supplied with a calibration certificate. Can be used for AFM, STM and SEM. Has been used successfully in a hot water AFM._x000D_ _x000D_ _x000D_ _x000D_ _x000D_ _x000D_ _x000D_ _x000D_ _x000D_ _x000D_ _x000D_ _x000D_ _x000D_ _x000D_ _x000D_ _x000D_ _x000D_ _x000D_ _x000D_ _x000D_

Nominal pattern dimensions	Pitch 750 nm
	Height 100 nm
Nominal specimen dimensions	6.35 nm diameter, 0.3 mm thick
Composition	Solid Nickel

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Model PT

_x000D_ Phase Imaging Test Specimen (verify TappingMode™ phase contrast and resolution)._x000D_ Phase Imaging is a sharp probe, which is brought into proximity with the specimen surface. The probe is oscillated vertically near its mechanical resonance fre-quency. As the probe lightly taps the surface, the amplitude of oscillation is reduced and the AFM uses this change in amplitude in order to track the surface topography. In addition to its amplitude, the probe motion can be characterized by its phase relative to a driving oscillator. The phase signal changes when the probe encounters regions of different composition. Phase shifts are registered as bright and dark regions in phase images, comparable to the way height changes are indicated in height images._x000D_ Phase images often show extraordinary contrast for many composite surfaces of technological and scientific interest. These include contamination deposits, discontinuous (i.e. defective) thin films, devices built of composite materials (e.g. magnetic recording heads), and cross-sectional specimens of composite materials. Both inorganic and organic materials can be examined. We have found that phase imaging is more convenient and gentler than other methods, which are based on contact mode operation. It routinely achieves lateral resolution of 10 nm._x000D_

Models 300-2D, 300-1D, 700-2D and 700-1D

_x000D_ All mounted on 15 mm steel disk._x000D_

Models 300-1D and 300-2D

_x000D_ _x000D_ Parallel Ridges_x000D_ Pitch 288_x000D_ W-coated Photoresist on Si_x000D_ use contact or TappingMode_x000D_

Models  300-2D

_x000D_ _x000D_ _x000D_ Array of Posts_x000D_ Pitch 297_x000D_ Al bumps on Si_x000D_ use contact or TappingMode_x000D_

Models 700-1D 

_x000D_ _x000D_ 700-1D_x000D_ Parallel Ridges_x000D_ Pitch 700_x000D_ W-coated Photoresist on Si_x000D_ use contact or TappingMode_x000D_

Models  700-2D

_x000D_ _x000D_ _x000D_ 700-2D_x000D_ Array of Posts_x000D_ Pitch 700_x000D_ W-coated Photoresist on Si_x000D_ use TappingMode_x000D_ _x000D_ References_x000D_ 1. Pereira, D.E.D. & Claudio-da-Silva, Jr., E. “Improvement of AFM as an analytical Instrument for Residual Lignin Characterization” in: Proceedings International Symposium on Wood and Pulping Chemistry, Helsinki, Finland, June 1995._x000D_ 2. Pereria, D.E.D, Chernoff, D., Claudio-da-Silva, Jr. E., & Cemuner, B.J., “The use of AFM to investigate the delignification process: Part I –AFM performance by differentiating pulping processes”, to be published.