0

Precision Diamond Wafering Blades

1,00 

(Precision Diamond Cut-Off Wheels)_x000D_
These bonded blades are constructed of an inner metal core and an outer rim, this rim is bonded with diamond particles. These blades come in high and low concentrations of diamond particles to handle various sectioning requirements:_x000D_
– High Concentration (H/C) for general laboratory use, either low or high saw’s speed_x000D_
– Low concentration (L/C) for sectioning hard and brittle materials, such as ceramics, silicon, glass, minerals

Description

Precision Diamond Wafering Blades – 50265-CL4

Informations complémentaires

Conc. particule diamant

Elevé

Diamètre

4"